| Silicon Wafer (200mm / 300mm) |
High-purity single-crystal silicon substrates used as the physical base for IC fabrication. |
substrate, wafer, silicon, fabrication |
| Photomask / Reticle |
Precision-patterned plate used in photolithography to transfer circuit patterns to wafers. |
lithography, mask, reticle, patterning |
| Photoresist & Chemistries |
Light-sensitive polymers and associated developers/strippers used in lithography steps. |
chemicals, photoresist, process-chem |
| Extreme Ultraviolet (EUV) Lithography Tool |
High-resolution exposure system for advanced nodes (e.g., 7 nm and below). |
lithography, EUV, equipment, advanced-node |
| Immersion / DUV Lithography Tool |
Deep-UV exposure systems for patterning at mature and mid-range nodes. |
lithography, DUV, equipment |
| Etch Equipment (RIE, DRIE) |
Plasma etchers for pattern transfer and high-aspect-ratio structures. |
etch, equipment, plasma |
| Deposition Tools (CVD, ALD, PVD) |
Systems for depositing thin films (oxides, nitrides, metals) with precise control. |
deposition, CVD, ALD, thin-film |
| Chemical Mechanical Planarization (CMP) |
Process and equipment to planarize wafer surfaces between layers. |
CMP, planarization, process |
| Metrology & Inspection Systems |
Tools for CD (critical dimension) measurement, defect inspection, overlay metrology. |
metrology, inspection, quality |
| Cleanroom Consumables |
Wipes, gloves, solvents, and filtration media required for contamination control. |
consumables, cleanroom, contamination |
| Process Gases & Purifiers |
High-purity gases (e.g., N2, Ar, H2, SiH4) and gas handling systems. |
gases, materials, process-chem |
| Maskless / Direct-Write Lithography |
Systems for rapid prototyping without physical photomasks. |
prototyping, lithography, maskless |
| Front-End-of-Line (FEOL) IP Blocks |
Transistors, standard cell libraries, high-voltage device IP used in front-end design. |
IP, FEOL, transistor, standard-cell |
| Back-End-of-Line (BEOL) Interconnects |
Metal layers, vias, and processes for wiring between devices. |
BEOL, interconnect, metallization |
| Logic SoC (System-on-Chip) |
Integrated chips combining CPU, GPU, accelerators and I/O for complex devices. |
SoC, logic, integration |
| Analog / Mixed-Signal ICs |
Amplifiers, ADCs, DACs, power management — interfaces between analog world and digital. |
analog, mixed-signal, PMIC |
| Memory (DRAM, SRAM, NAND) |
Volatile and non-volatile memory technologies with different trade-offs. |
memory, DRAM, NAND, SRAM |
| Power Devices (IGBT, MOSFET, GaN, SiC) |
High-voltage/current devices for power conversion and motor drives. |
power, GaN, SiC, discrete |
| RF & mmWave Components |
RF front-end ICs, LNAs, PAs, mixers for wireless communication. |
RF, mmWave, communication |
| Analog IP (PLL, ADC, DAC, SerDes) |
Reusable blocks for timing, conversion and high-speed I/O. |
IP, analog, SerDes |
| FPGA / CPLD |
Reconfigurable logic devices for prototyping or adaptable systems. |
FPGA, programmable, prototyping |
| ASIC Design Services |
Full custom and standard-cell ASIC design, from RTL to tape-out. |
services, ASIC, design |
| EDA Tools (Synthesis, Place & Route, LVS) |
Software for design, verification, and physical implementation. |
EDA, tools, verification |
| Test & Validation Equipment |
Automated test equipment (ATE), probe cards, burn-in chambers, testers. |
test, ATE, validation |
| Wafer Probe & Probe Cards |
Contact systems for wafer-level electrical testing. |
probe, wafer-test, equipment |
| OSAT / Packaging Solutions |
Outsourced semiconductor assembly and testing: wirebond, flip-chip, BGA, CSP. |
packaging, OSAT, assembly |
| Advanced Packaging (2.5D / 3D TSV / SiP) |
High-density integration methods — interposers, through-silicon vias, heterogeneous stacking. |
packaging, 3D, TSV, SiP |
| Thermal Interface Materials & Heat Spreaders |
Materials and solutions for thermal management at package and system level. |
thermal, TIM, cooling |
| Electrostatic Protection & Handling |
ESD-safe trays, carriers, and handling systems to prevent damage. |
ESD, handling, logistics |
| Specialty Substrates (SOI, GaAs, InP) |
Alternative substrate materials for RF, photonics, or low-power applications. |
substrate, SOI, compound-semiconductor |
| Photonics Components (Laser, Modulator, PD) |
Integrated photonic devices and modules for optical I/O and sensing. |
photonics, optical, PIC |
| MEMS Sensors & Actuators |
Microelectromechanical devices: accelerometers, gyros, microphones. |
MEMS, sensors, microsystems |
| Test IP & BIST (Built-In Self Test) |
On-chip test architectures used to validate function and yield. |
test, BIST, DFT |
| Yield-Enhancement Services & Analytics |
Software and services for statistical yield analysis and defect reduction. |
yield, analytics, manufacturing |
| Supply Chain Components (EBM, logistics, kitting) |
Logistics, vendor management, and procurement services tailored to fabs. |
supply-chain, logistics |
| Process Integration & Recipe Development |
Engineering services to integrate modules into a manufacturable flow. |
integration, services, recipe |
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